5G Module

Model G5G-X55Q

Global Telecom’s G5G-X55Q is the company’s first 5G module –- a cutting-edge product engineered to serve as the foundational technology for smart devices in the Internet of Things. The module is designed for all types of applications that need low latency and high throughput data communication across a variety of radio propagation conditions.

It’s a multi-band 5G NR / LTE-FDD / LTE-TDD module solution, with a 4×4 MIMO, M.2 interface supporting R15 5G NSA / SA with up to 4.0 Gbps data transfer speed. It has strong extension capability with rich interfaces, including PCIe, USB3.1, GPIO and more. The G5G-X55Q is packaged around the M.2 form factor with AT commands that are fully compatible with 3GPP standards.

A unique combination of performance, security and flexibility makes the G5G-X55Q an ideal choice for organizations in need of broad applications with low financial investment and short time to market.

Key Benefits
• Standard M.2 interface
• 3G / 4G / 5G multimode support
• High throughput data communication
• Rich networking and user interfaces
• Standard AT command support

General Features
• Supply voltage range: 3.135 V ~ 4.4 V (Typical: 3.8 V)
• Control via AT commands
• Operation temperature: -30 C to 50 C
• Dimensions: 30.0 mm x 52.0 mm x 2.3 mm
• Weight: approximately 20 g
• Sub-6G / LTE-FDD / LTE-TDD / WCDMA
• GNSS: GPS / GLONASS

Other Features
• USB driver for Microsoft Windows Win 7 / Win 8 / Win 10
• USB driver for Linux / Android
• RIL support for Android 5.0 / 6.0 / 7.0 / 8.0
• RNDIS / NDIS / PPP / MBIM to Win 8
• Firmware update via USB
• TCP/IP / IPV4 / IPV6 /Multi-PDP / FTPS / HTTPS / MQTTS / DNS
• SSL3.0 / TLS1.0 / TLS1.2
• DTMF (sending and receiving)
• VoNR / VoLTE / CSFB
• FOTA / OTA
• AGPS / SUPL2.0
• Dedicated GNSS_L1 and GNSS_L2/L5

Data
• Sub-6G
– Uplink up to 300 Mbps
– Downlink up to 4 Gbps
• LTE Cat 20
– Uplink up to 150 Mbps
– Downlink up to 2.4 Gbps
• HSPA+
– Uplink up to 5.76 Mbps
– Downlink up to 42 Mbps

Approvals
• RoHS compliant
• FCC*
• GCF*

Interfaces
• USB 2.0 with high speeds (up to 480 Mbps)
• USB 3.1 with SS Gen2
• UART
• (U)SIM card (1.8 V /3.0 V)
• Digital audio through PCM
• I2C
• GPIOs
• PCIe Gen3